Experimental and Numerical Thermal Transient Behavior of...

Journal of Electronic Packaging 2004 Vol. 126; Iss. 4

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

Tso, C. P., Tou, K. W., Bhowmik, H.
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Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1827270
File:
PDF, 368 KB
english, 2004
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