![](/img/cover-not-exists.png)
Maximizing Solder Joint Reliability Through Optimal Shape Design
Deshpande, A. M., Subbarayan, G., Mahajan, R. L.Volume:
119
Year:
1997
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792227
File:
PDF, 781 KB
english, 1997