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Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation
Basaran, C., Desai, C. S., Kundu, T.Volume:
120
Year:
1998
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792284
File:
PDF, 683 KB
english, 1998