Measurement of Interfacial Fracture Toughness Under...

Journal of Electronic Packaging 1998 Vol. 120; Iss. 4

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

Jiao, J., Gurumurthy, C. K., Kramer, E. J., Sha, Y., Hui, C. Y., Borgesen, P.
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Volume:
120
Year:
1998
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792645
File:
PDF, 519 KB
english, 1998
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