![](/img/cover-not-exists.png)
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
Pierce, David M., Sheppard, Sheri D., Vianco, Paul T.Volume:
131
Year:
2009
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.3068313
File:
PDF, 1.16 MB
english, 2009