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Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
Zhang, Jianhua, Yuan, Fang, Zhang, JinsongVolume:
131
Year:
2009
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4000361
File:
PDF, 553 KB
english, 2009