On-Line Quality Detection of Ultrasonic Wire Bonding via...

Journal of Electronic Packaging 2010 Vol. 132; Iss. 4

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Feng, Wuwei, Meng, Qingfeng, Xie, Youbo, Fan, Hong
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Volume:
132
Year:
2010
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4002900
File:
PDF, 1.50 MB
english, 2010
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