Bulk Resistance Evaluation of Anisotropic Conductive...

Journal of Electronic Packaging 2012 Vol. 134; Iss. 3

Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect

Chen, X. C., Tao, Bo, Yin, Z. P.
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Volume:
134
Year:
2012
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4006889
File:
PDF, 1.45 MB
english, 2012
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