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Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
Yan, Yi, Chen, Xu, Liu, Xingsheng, Mei, Yunhui, Lu, Guo-QuanVolume:
134
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4007271
Date:
August, 2012
File:
PDF, 1.96 MB
english, 2012