Die Bonding of High Power 808 nm Laser Diodes With...

Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste

Yan, Yi, Chen, Xu, Liu, Xingsheng, Mei, Yunhui, Lu, Guo-Quan
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Volume:
134
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4007271
Date:
August, 2012
File:
PDF, 1.96 MB
english, 2012
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