![](/img/cover-not-exists.png)
Experimental and Modeling Studies of Looping Process for Wire Bonding
Wang, Fuliang, Chen, YunVolume:
135
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4025667
Date:
November, 2013
File:
PDF, 3.95 MB
english, 2013