A Shear Strength Degradation Model for Anisotropic...

Journal of Electronic Packaging 2013 / 11 Vol. 135; Iss. 4

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Tao, Bo, Wu, Guanghua, Yin, Zhouping, Xiong, Youlun
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Volume:
135
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4025840
Date:
November, 2013
File:
PDF, 1.23 MB
english, 2013
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