Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps
Lee, Chang-Chun, Lin, Po TingVolume:
136
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4026854
Date:
May, 2014
File:
PDF, 3.53 MB
english, 2014