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Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation
Sadiq, Muhammad, Lecomte, Jean-Sebastien, Cherkaoui, MohammedVolume:
137
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4029836
Date:
September, 2015
File:
PDF, 3.10 MB
english, 2015