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Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis
Bhagavat, M., Prasad, V., Kao, I.Volume:
122
Year:
2000
Language:
english
Journal:
Journal of Tribology
DOI:
10.1115/1.555375
File:
PDF, 882 KB
english, 2000