[ASME ASME 2005 International Mechanical Engineering Congress and Exposition - Orlando, Florida, USA (November 5 – 11, 2005)] Heat Transfer, Part A - Thermal Performance of Micro-Structured Evaporation Surfaces: Application to Cooling of High Flux Microelectronics
Al-Hajri, E., Ohadi, M., Dessiatoun, S. V., Qi, J.Volume:
2005
Year:
2005
Language:
english
DOI:
10.1115/imece2005-82583
File:
PDF, 325 KB
english, 2005