Thermomechanical Stress Analysis of Multi-Layered...

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Wen, Yujun, Basaran, Cemal
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Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1535446
File:
PDF, 308 KB
english, 2003
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