The Strength of the Silicon Die in Flip-Chip Assemblies

Journal of Electronic Packaging 2003 Vol. 125; Iss. 1

The Strength of the Silicon Die in Flip-Chip Assemblies

Cotterell, B., Chen, Z., Han, J.-B., Tan, N.-X.
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Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1535934
File:
PDF, 201 KB
english, 2003
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