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On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources
Ortega, Alfonso, Ramanathan, ShankarVolume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1569506
File:
PDF, 205 KB
english, 2003