Dependence of Thermal Conductivity and Mechanical Rigidity...

Journal of Electronic Packaging 2003 Vol. 125; Iss. 3

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Prasher, Ravi S., Koning, Paul, Shipley, James, Devpura, Amit
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Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1602703
File:
PDF, 223 KB
english, 2003
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