Area-Selective Adhesive Bonding Using Photosensitive BCB...

Journal of Electronic Packaging 2005 Vol. 127; Iss. 1

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

Polyakov, A., Bartek, M., Burghartz, J. N.
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Volume:
127
Year:
2005
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1846059
File:
PDF, 318 KB
english, 2005
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