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Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
Wei, X. J., Joshi, Y. K., Ligrani, P. M.Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429711
File:
PDF, 563 KB
english, 2007