Investigations of the Thermal Spreading Effects of...

Journal of Electronic Packaging 2007 Vol. 129; Iss. 3

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Chen, Yen-Shu, Chien, Kuo-Hsiang, Wang, Chi-Chuan, Hung, Tzu-Chen, Ferng, Yuh-Ming, Pei, Bau-Shei
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Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2753970
File:
PDF, 327 KB
english, 2007
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