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High Thermal Conductive Si[sub 3]N[sub 4] Particle Filled Epoxy Composites With a Novel Structure
He, Hong, Fu, Renli, Han, Yanchun, Shen, Yuan, Wang, DeliuVolume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2804097
File:
PDF, 460 KB
english, 2007