Effects of Heat Intensity, Size, and Position of the...

Journal of Electronic Packaging 1990 Vol. 112; Iss. 3

Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure

Du, Z.-G., Bilgen, E.
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Volume:
112
Year:
1990
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2904374
File:
PDF, 640 KB
english, 1990
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