Experimental Modal Analysis and Dynamic Response Prediction...

Journal of Electronic Packaging 1991 Vol. 113; Iss. 3

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Wong, Tin-Lup, Stevens, Karl K., Wang, Gang
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Volume:
113
Year:
1991
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905402
File:
PDF, 894 KB
english, 1991
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