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Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling
Heindel, T. J., Ramadhyani, S., Incropera, F. P.Volume:
114
Year:
1992
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905443
File:
PDF, 983 KB
english, 1992