Low Temperature Transient Liquid Phase (LTTLP) Bonding for...

Journal of Electronic Packaging 1992 Vol. 114; Iss. 4

Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections

Hou, M. M., Eagar, Thomas W.
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Volume:
114
Year:
1992
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905478
File:
PDF, 882 KB
english, 1992
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