Application of Stochastic Finite Element Method to Thermal...

Journal of Electronic Packaging 1993 Vol. 115; Iss. 3

Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

Kieda, Shigekazu, Ashiwake, Noriyuki, Daikoku, Takahiro, Zushi, Shizuo
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Volume:
115
Year:
1993
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2909328
File:
PDF, 692 KB
english, 1993
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