Underfill Filler Settling Effect on the Die Backside...

Journal of Electronic Packaging 2008 Vol. 130; Iss. 3

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Chen, Cheng-fu, Karulkar, Pramod C.
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Volume:
130
Year:
2008
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2957324
File:
PDF, 846 KB
english, 2008
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