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Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
Abdullah, M. K., Abdullah, M. Z., Mujeebu, M. A., Gitano, Horizon, Ariff, Z. M., Razali, R., Ahmad, K. A.Volume:
132
Year:
2010
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4000719
File:
PDF, 554 KB
english, 2010