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Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
Wakil, Jamil A., Dehaven, Patrick W., Klymko, Nancy R., Chen, ShaochenVolume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4004656
File:
PDF, 4.57 MB
english, 2011