Thermal Performance of a Water-Cooled Microchannel Heat Sink With Grooves and Obstacles
Xie, Yonghui, Shen, Zhongyang, Zhang, Di, Lan, JibingVolume:
136
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4025757
Date:
April, 2014
File:
PDF, 1.92 MB
english, 2014