[ASME ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference - Chicago, Illinois, USA (Sunday 12 August 2012)] Volume 2: 32nd Computers and Information in Engineering Conference, Parts A and B - Finite Element Analysis of Printed Circuit Boards Using Isotropic Elastoplastic Model and Application to Drop Simulation for Mobile Phone
Jeon, Hojin, Park, Myunghyun, Seo, Hyongwon, Kim, Myunghan, Lee, YongheeYear:
2012
Language:
english
DOI:
10.1115/detc2012-70781
File:
PDF, 699 KB
english, 2012