[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials
Prasher, Ravi S., Shipley, Jim, Prstic, Suzana, Koning, Paul, Wang, Jin-LinVolume:
2003
Year:
2003
Language:
english
DOI:
10.1115/imece2003-41034
File:
PDF, 454 KB
english, 2003