Microstructural Evolution of Lead-Free Solder Joints in...

Journal of Electronic Materials 2016 / 1 Vol. 45; Iss. 1

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Ji, Hongjun, Wang, Qiang, Li, Mingyu
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Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-4108-7
Date:
January, 2016
File:
PDF, 3.17 MB
english, 2016
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