![](/img/cover-not-exists.png)
Design and analysis of jitter-aware low-power and high-speed TSV link for 3D ICs
Beanato, Giulia, Gharibdoust, Kiarash, Cevrero, Alessandro, Micheli, Giovanni De, Leblebici, YusufVolume:
48
Language:
english
Journal:
Microelectronics Journal
DOI:
10.1016/j.mejo.2015.12.003
Date:
February, 2016
File:
PDF, 5.45 MB
english, 2016