Molecular Dynamics Simulation of Thermal Cycling Test in...

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

Fan, Hai Bo, Chan, Edward K. L., Wong, Cell K. Y., Yuen, Matthew M. F.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429707
File:
PDF, 659 KB
english, 2007
Conversion to is in progress
Conversion to is failed