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Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging
Fan, Hai Bo, Chan, Edward K. L., Wong, Cell K. Y., Yuen, Matthew M. F.Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429707
File:
PDF, 659 KB
english, 2007