Effect of Microstructure Size on Deformation Kinetics and...

Journal of Electronic Packaging 1996 Vol. 118; Iss. 2

Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints

Guo, Zhenfeng, Conrad, Hans
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Volume:
118
Year:
1996
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792131
File:
PDF, 751 KB
english, 1996
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