The Effect of Stencil Printing Optimization on Reliability...

Journal of Electronic Packaging 1998 Vol. 120; Iss. 1

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Li, Y., Mahajan, R. L., Subbarayan, G.
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Volume:
120
Year:
1998
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792286
File:
PDF, 854 KB
english, 1998
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