Effects of Thickness on Thermal Stresses in a Thin Solder...

Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer

Kuo, An-Yu, Chen, Kuan-Luen
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Volume:
114
Year:
1992
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2906418
File:
PDF, 495 KB
english, 1992
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