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Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits
van Vroonhoven, J. C. W.Volume:
115
Year:
1993
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2909298
File:
PDF, 1.15 MB
english, 1993