High Performance Anisotropic Conductive Adhesives Using...

Journal of Electronic Packaging 2010 Vol. 132; Iss. 1

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Yim, Myung Jin, Li, Yi, Moon, Kyoung Sik, Wong, C. P.
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Volume:
132
Year:
2010
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4001229
File:
PDF, 551 KB
english, 2010
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