[ASME ASME 2008 9th Biennial Conference on Engineering Systems Design and Analysis - Haifa, Israel (July 7–9, 2008)] Volume 4: Fatigue and Fracture; Fluids Engineering; Heat Transfer; Mechatronics; Micro and Nano Technology; Optical Engineering; Robotics; Systems Engineering; Industrial Applications - Direct Wire-Bonding to Silicon Devices Without the Use of Metallic Layers

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