![](/img/cover-not-exists.png)
[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 1 - Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package
Kanda, Yoshihiko, Zama, Kunihiro, Kariya, Yoshiharu, Mikami, Takao, Kobayashi, Takaya, Sato, Toshiyuki, Enomoto, Toshiaki, Hirata, KoichiYear:
2009
Language:
english
DOI:
10.1115/interpack2009-89152
File:
PDF, 354 KB
english, 2009