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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Temperature Measurement by Using Metal Thin Film Thermocouples
Miyazaki, Koji, Tsukamoto, Hiroshi, Miike, Takahiro, Takamiya, ToshiakiYear:
2003
Language:
english
DOI:
10.1115/ipack2003-35042
File:
PDF, 532 KB
english, 2003