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[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 - Stress Mapping Below Flip-Chip Bumps With High Spatial Resolution Using Piezoresistive CMOS Sensors
Lemke, Benjamin, Paul, Oliver, Ganapathysubramanian, Shankar, Nardi, Patrick, Baskaran, RajashreeYear:
2011
Language:
english
DOI:
10.1115/ipack2011-52124
File:
PDF, 1.39 MB
english, 2011