![](/img/cover-not-exists.png)
[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Comparative Thermal and Energy Analysis of a Hybrid Cooling Data Center With Rear Door Heat Exchangers
Gao, Tianyi, Samadiani, Emad, Sammakia, Bahgat, Schmidt, RogerYear:
2013
Language:
english
DOI:
10.1115/ipack2013-73101
File:
PDF, 1.87 MB
english, 2013