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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - A Parametric Numerical Study in Cylindrical Oblique Fin Minichannel
Fan, Yan, Lee, Poh Seng, Jin, Li-Wen, Chua, Beng Wah, Mou, Na-Si, Jagirdar, MrinalYear:
2013
Language:
english
DOI:
10.1115/ipack2013-73162
File:
PDF, 1.58 MB
english, 2013