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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications
Gebrehiwot, Betsegaw, Dhiman, Nikhil, Rajagopalan, Kasturi, Agonafer, Dereje, Kannan, Naveen, Hoverson, James, Kaler, MikeYear:
2013
Language:
english
DOI:
10.1115/ipack2013-73302
File:
PDF, 1.94 MB
english, 2013