Nano‐ and micro‐filled conducting adhesives for...

Circuit World 2008 / 02 Vol. 34; Iss. 1

Nano‐ and micro‐filled conducting adhesives for z ‐axis interconnections: new direction for high‐speed, high‐density, organic microelectronics packaging

Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.
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Volume:
34
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120810848743
Date:
February, 2008
File:
PDF, 608 KB
english, 2008
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